NAME

Physics::Electrodeposition::CopperPlating - First-order copper electroplating model for Al/Ti seed layers

SYNOPSIS

use Physics::Electrodeposition::CopperPlating;

my $sim = Physics::Electrodeposition::CopperPlating->new(
    wafer_diameter_mm => 300,
    pattern_type      => 'redistribution_lines',
    convection        => 'high',
    target_thickness_um => 8,
);

my $result = $sim->simulate;

DESCRIPTION

This module provides a simple engineering estimate for copper electroplating on an aluminum and titanium seed stack for 200 mm and 300 mm wafers. It is meant for early process tradeoff studies rather than detailed electrochemical design.

METHODS

new(%args)

Creates a simulation object.

simulate(%overrides)

Returns a hash reference containing expected current, growth rate, plating time, and estimated within-wafer uniformity.

process_notes(%overrides)

Returns an array reference of process assumptions and qualitative notes.